SUNON Unveils Five Core Liquid Cooling Technologies at OCP 2026, Expanding Its Presence in AI Thermal Management

SUNON, a global leader in thermal management solutions, unveiled its latest liquid cooling technologies at the OCP Global Summit 2026 in the United States, showcasing solutions specifically designed for next-generation servers and AI computing applications.

Under the theme “Build to Chill,” SUNON highlights its continued commitment to thermal innovation, going beyond building high performance cooling systems to developing advanced solutions that address the evolving thermal challenges of AI infrastructure.

SUNON is showcasing five core liquid cooling technologies at OCP 2026:

1. Standard Cold Plates and Emerging Cooling Applications (Cold Plate and DIMM)Designed to support Intel and AMD server platforms, SUNON continues to develop standardized liquid cooling solutions aligned with the latest processor specifications, while expanding into emerging thermal applications such as DIMM cooling.

2. Customized Liquid Cooling SolutionsSUNON provides flexible, application-specific liquid cooling solutions with configurable components and system architectures to meet diverse customer requirements.

3. 3D Printed Cold Plate TechnologyAs part of SUNON’s exploration of next-generation thermal technologies, the company is collaborating with 3D Architech to advance 3D-printed cold plate development. The technology enables greater design freedom for internal flow channels and structures, helping reduce thermal resistance and enhance cooling performance.

4. In Rack Coolant Distribution Units (CDU)SUNON’s In-Rack CDU portfolio supports both liquid to liquid (L2L) and liquid to air (L2A) architectures, addressing a wide range of liquid cooling requirements, from laboratory validation and development environments to high density AI rack deployments.

5. In Row Coolant Distribution Units (CDU)By integrating SUNON’s expertise in HVAC and fan technologies, the In Row CDU platform demonstrates the company’s capabilities in the design, development, and system integration of large scale cooling infrastructure.

With a comprehensive liquid cooling portfolio, SUNON delivers thermal solutions for a broad range of AI and server applications. Moving forward, SUNON will continue to advance innovative cooling technologies, support the evolution of open computing architectures, and help enable a future of high-performance, energy-efficient, and sustainable computing.