Company
SUNON Unveils Innovative Liquid Cooling Solutions for High-Performance Applications at the 2024 OCP Global Summit in San Jose
2024.09.27
Presenting Cutting-Edge Technology for Data Center Innovation and Green
Sunonwealth Electric (2421.TW), a leading total solution supplier, is excited to announce that we will showcase our breakthrough liquid cooling technology and thermal solutions for the first time at the 2024 OCP Global Summit, taking place from October 15-17 in San Jose, USA. This Summit is a landmark event for global CSP and server supply chains, as well as a premier platform for members of the Open IT Ecosystem to share market insights, discuss standardized and modularized design and technical services, and demonstrate advanced technology for large-scale data centers. The theme of this year’s OCP Global Summit, "From Ideas to Impact," underscores the organization's commitment to fostering innovation that leads to tangible, real-world solutions.
At SUNON Booth #C35, we will showcase a range of novel liquid cooling modules and systems that exemplify our pioneering approach to thermal technology. One highlight will be our Advanced Air-Liquid Cooling (AALC) with sidecar, which seamlessly integrates both liquid-cooled and air-cooled designs ― including a fan wall, PSU, HRU, and RPU ― into a single cabinet. This solution connects to an AI server rack, offering significant heat dissipation, operational efficiency, and stability during high-performance computing tasks, making it ideal for CPU-bound, data-intensive, and I/O-bound applications. Furthermore, the AALC is a cost-effective solution that meets the demands of global server development and sustainability by combining existing air-cooled systems with new liquid-cooled systems, all without requiring the replacement of existing infrastructure or air conditioning equipment.
In addition, SUNON will display a variety of Immersion Fans for Single-phase Immersion Cooling. We worked together with clients to achieve an in-system temperature reduction of 17℃. We will feature a dynamic display of our Two-Phase Liquid Cooling Module for Workstation. This module efficiently dissipate heat from CPUs and GPUs, enabling continuous 24/7 operation at optimal temperatures. Its non-pump design reduces noise and energy consumption, while its highly reliable cooling system and low GWP coolant selection minimize the risk of leaks, crashes, or failures. Alongside these innovations, SUNON will also display a variety of efficient cooling fans (ranging from 40mm to 200mm), heatsink modules for both general-purpose and application-specific CPUs, open-loop cold plates, and water pumps tailored to client needs. SUNON aims to expand its liquid cooling portfolio and offer comprehensive liquid-to-air design services to help global clients manage rapidly evolving IT infrastructures.
SUNON is dedicated to creating a robust liquid cooling solution ecosystem for modern data centers and we are already working with the renowned AI customers. By offering 2E: effective and efficient cooling solutions, we aim to enhance processing capacity and maximize power utilization, thereby lowering PUE (Power Usage Effectiveness). Moreover, SUNON’s scalable and optimal heat dissipation solutions are designed with a strong emphasis on environmental sustainability, supporting the global application industry’s commitment to greener practices.
Visit SUNON at Booth #C35 at the San Jose Convention Center from October 15 to 17, 2024, to explore our advanced thermal and cooling solutions for sustainable data centers.
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