SUNON to Showcase Liquid Cooling Solutions at OCP Global Summit 2025, Collaborating with the Industry to Shape the Future of Open Compute.

SUNON will participate in the OCP Global Summit 2025, taking place from October 13–16, 2025, at the San Jose McEnery Convention Center, California. With the theme "Build to Chill," SUNON will unveil its latest generation of liquid cooling systems, highlighting high-performance cooling solutions for servers, cloud computing infrastructure. The showcase underscores SUNON's deep technical capabilities in modular design, energy efficiency, and thermal reliability.

This year's OCP Global Summit, themed “Leading the Future of AI,”will bring together global cloud service providers, server manufacturers, open hardware developers, and key data center decision-makers. SUNON aims to engage in meaningful dialogue with technology leaders and explore future collaboration in advancing open compute standards and AI infrastructure cooling.

With the rapid expansion of AI model training and rising server heat density, data centers face increasingly demanding thermal challenges. SUNON's latest showcase will include: cold plates designed for server components, integrated thermal modules, and Coolant Distribution Units (CDUs). These solutions are engineered to support and provide scalable cooling options for next-generation computing environments.

We don't just design cooling products — we build the backbone of reliability for the future of AI computing,” said Mr. Simon Wu, Executive Vice President of SUNON.

we sincerely invite global partners and industry leaders to visit our booth and experience how next-generation liquid cooling solutions can enable efficient, modular, and scalable computing.”

【Exhibition Details】
● Event: 2025 OCP Global Summit
● Date: October 13–16, 2025
● Venue: San Jose McEnery Convention Center | San Jose, California, USA.
● SUNON Booth No : A53

Learn more about SUNON at OCP 2025