SUNON SP5_1U, exclusive to 1U server, copper and aluminum are used as base materials due to their highly thermal conductivity. The combination of high-density fin and unique heat pipes is the module design that results in an excellent thermal performance better than it requires. It supports up to 300 Watts CPU power heat dissipation.
| SUNON P/N |
: |
SM321-22001Y |
| CPU Support |
: |
AMD Genoa 9004 Series Processors |
| CPU Socket |
: |
SP5 / LGA 6096 |
| Solution |
: |
1U Server and up |
| Dimensions (mm) |
: |
118x92.4x29.18mm |
| *TDP (W) |
: |
300W |
| Weight (g) |
: |
340g |
| Material |
: |
Aluminum, Copper, ADC10 |
| Surface Treatment |
: |
Nickle plating |
| TIM |
: |
SHIN-ETSU X23-7762 |
* TDP=Thermal Power
* Standard debut will be released on Apr. 14, 2023
