Showcasing Liquid Cooling Solutions for Next-Generation AI Computing

Global thermal solutions provider SUNON is showcasing its next-generation AI liquid cooling solutions at OCP Global Summit 2026 in San Jose, California. Under the theme “Build to Chill,” SUNON highlights its comprehensive liquid cooling technologies designed to address the increasing power and thermal demands of AI and high performance computing from chip level cooling to server and rack level applications.SUNON once again joins the NVIDIA MGX Ecosystem as an ecosystem partner, reinforcing its role in advancing next-generation liquid cooling solutions for AI computing and high-performance infrastructure.

As AI computing continues to drive higher power densities, data centers require more advanced and efficient cooling solutions. SUNON develops integrated liquid cooling solutions to address these evolving thermal challenges with standard and customized liquid cooling solutions to In Rack and In Row Coolant Distribution Units (CDUs) solutions, supporting customers through the product journey.

From Standard Platforms to Custom Cooling Solutions
At the chip level, SUNON is showcasing standardized liquid cooling solutions designed for leading CPU platforms, including solutions for AMD’s SP8, Intel’s Oakstream, and DIMM cooling applications.

Beyond standard solutions, SUNON works closely with customers to understand their specific thermal and mechanical requirements, developing customized cooling solutions optimized for their target specifications and performance needs.

Exploring 3D Printed Cold Plates with 3D Architech
To address the cooling challenges of next-generation high-power, high-heat-flux processors, SUNON is collaborating with 3D Architech on advanced 3D-printed cold plate technology.

3D printing enables greater flexibility in cold plate structural design, allowing the solution to better align with the chip’s heat sources. Based on current research results, the technology has demonstrated improved thermal resistance compared with commercially available solutions, offering new possibilities for high power chip cooling.

From Test and Validation to High-Density Computing
SUNON will showcase two in-rack CDU solutions designed for different liquid cooling applications. The 200 kW liquid to liquid (L2L) 5U CDU is designed to support high-density AI rack cooling, while the 7 kW liquid to air (L2A) 4U CDU provides a platform suited for laboratory testing, validation, and development environments.

Through CDU designs with different architectures and cooling capacities, SUNON is building a more flexible portfolio of rack level liquid cooling solutions, supporting applications ranging from product development and validation to high density computing.

Showcasing 300 kW CDU System Integration Capability
SUNON will also showcase a 300 kW three-rack liquid-to-air (L2A) CDU, demonstrating its engineering and system integration capabilities for high-capacity liquid cooling systems designed for AI and HPC environments.

The system highlights SUNON’s expertise in thermal management, system integration, and large scale CDU development.

From Chip to Rack: Building Complete Liquid Cooling Capabilities
Through OCP Global Summit 2026, SUNON demonstrates its comprehensive liquid cooling capabilities, spanning from chip and server level solutions to rack level CDUs.

As AI infrastructure continues to evolve rapidly, SUNON will further deepen collaboration with global chip, server, and data center partners to drive the development of next generation liquid cooling solutions that deliver greater efficiency, reliability, and scalability.

【Exhibition Information】
● Event： OCP Global Summit 2026
● Date： October 12–15, 2026
● Venue： San Jose McEnery Convention Center, San Jose, California, USA
● SUNON Booth： A19